DocumentCode
2179954
Title
Impact analysis of silicon and bondwires on an on-chip antenna
Author
Gentner, Philipp K. ; Adalan, Ayse ; Scholtz, Arpad L. ; Mecklenbräuker, Christoph F.
Author_Institution
Inst. of Telecommun., Vienna Univ. of Technol., Vienna, Austria
fYear
2012
fDate
26-30 March 2012
Firstpage
3168
Lastpage
3172
Abstract
The efficiency of integrated on-chip antennas is low due to their small aperture and lossy environment. In this contribution, the influence of the silicon bulk substrate´s thickness and conductivity is evaluated as well as the influence of bondwires in close vicinity to an on-chip antenna. The impact on the antenna impedance and radiation pattern is analysed and discussed. Measurements of an on-chip antenna manufactured by utilising the top metal layer of a standard Complementary Metal-Oxide Semiconductor (CMOS) are compared to simulation results.
Keywords
CMOS integrated circuits; antenna radiation patterns; silicon; CMOS; antenna impedance; bondwires; complementary metal-oxide semiconductor; conductivity; impact analysis; metal layer; on-chip antenna; radiation pattern; silicon bulk substrate thickness; Antenna measurements; Conductivity; Dipole antennas; Q factor; Silicon; Substrates; System-on-a-chip;
fLanguage
English
Publisher
ieee
Conference_Titel
Antennas and Propagation (EUCAP), 2012 6th European Conference on
Conference_Location
Prague
Print_ISBN
978-1-4577-0918-0
Electronic_ISBN
978-1-4577-0919-7
Type
conf
DOI
10.1109/EuCAP.2012.6206043
Filename
6206043
Link To Document