DocumentCode
2180555
Title
Design of multi-finger HBTs with a thermal-electrical model
Author
Chang, Yang-Hua ; Chang-Chiang, Chen-Chun ; Lee, Yueh-Cheng ; Liu, Chi-Chung
Author_Institution
Nat. Yunlin Univ. of Sci. & Technol., Yun-Lin, Taiwan
fYear
2002
fDate
2002
Firstpage
95
Lastpage
98
Abstract
Temperature distribution on the emitter fingers of heterojunction bipolar transistors (HBTs) is studied with a three-dimensional thermal-electrical model. Using this model, multi-finger HBTs is designed with non-uniform spacing. An efficient design procedure is presented. The calculated results show significant temperature reduction on non-uniform spacing devices.
Keywords
heterojunction bipolar transistors; semiconductor device models; temperature distribution; emitter finger; heterojunction bipolar transistor; multi-finger HBT design; temperature distribution; three-dimensional thermal-electrical model; Delay; Electronic ballasts; Electronic mail; Equations; Fingers; Gallium arsenide; Heterojunction bipolar transistors; Resistors; Temperature distribution; Thermal conductivity;
fLanguage
English
Publisher
ieee
Conference_Titel
Electron Devices Meeting, 2002. Proceedings. 2002 IEEE Hong Kong
Print_ISBN
0-7803-7429-0
Type
conf
DOI
10.1109/HKEDM.2002.1029165
Filename
1029165
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