Challenges in aerospace packaging

We describe packaging technology for low-profile parallel optic transceivers utilized in harsh environment applications that exploits advances made in ASIC packaging. Presently, the cost associated with ceramic hybrid packaging dominates the overall cost of producing transceivers fielded in aerospace systems. While mil-grade electronic components have transitioned from ceramic packaging to modern plastic encapsulated microcircuit (PEM) packaging, OE components in this form of contemporary packaging are unproven in aerospace applications. This paper describes an approach that leverages reduced cost microelectronic packaging methods and materials that are today used for military airframe electronic components. This approach also creates a packaging platform for transceivers with enhanced maintenance (built-in-test and detachable fiber connector) and performance (4x increased data rates).