• DocumentCode
    2184092
  • Title

    Viscosity and thermal conductivity of alumina microball/epoxy composites

  • Author

    Yu, Hui ; Li, Liangliang ; Qi, Longhao

  • Author_Institution
    Dept. of Mater. Sci. & Eng., Tsinghua Univ., Beijing, China
  • fYear
    2011
  • fDate
    8-11 Aug. 2011
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    Filling ceramic particles that exhibit high thermal conductivity into a polymer is an effective way to enhance the thermal conductivity of the polymer. Alumina (Al2O3) microballs were chosen as the fillers to confirm whether their super-spherical structure would enlarge the maximum filling content of the filler into the polymer matrix. The impacts of Al2O3 microballs on the thermal conductivity of the composites and the viscosity of pre-curing suspension were investigated. The viscosity increased slightly when a 20 vol. % of Al2O3 microballs were filled, and when the filling content reached 50 vol. %, the viscosity was still relatively lower than that of the epoxy with roughly spherical AlN granules. A high thermal conductivity of 2.70 W/(m·K) was achieved with an Al2O3 microball content of 60 vol. %.
  • Keywords
    alumina; ceramics; composite materials; polymers; thermal conductivity; viscosity; Al2O3; alumina microball; ceramic particles; epoxy composites; polymer matrix; pre-curing suspension; superspherical structure; thermal conductivity; viscosity; Ceramics; Conductivity; Electronic packaging thermal management; Filling; Polymers; Thermal conductivity; Viscosity; alumina microballs; composite; thermalconductivity; viscosity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2011 12th International Conference on
  • Conference_Location
    Shanghai
  • Print_ISBN
    978-1-4577-1770-3
  • Electronic_ISBN
    978-1-4577-1768-0
  • Type

    conf

  • DOI
    10.1109/ICEPT.2011.6066859
  • Filename
    6066859