DocumentCode
2184092
Title
Viscosity and thermal conductivity of alumina microball/epoxy composites
Author
Yu, Hui ; Li, Liangliang ; Qi, Longhao
Author_Institution
Dept. of Mater. Sci. & Eng., Tsinghua Univ., Beijing, China
fYear
2011
fDate
8-11 Aug. 2011
Firstpage
1
Lastpage
4
Abstract
Filling ceramic particles that exhibit high thermal conductivity into a polymer is an effective way to enhance the thermal conductivity of the polymer. Alumina (Al2O3) microballs were chosen as the fillers to confirm whether their super-spherical structure would enlarge the maximum filling content of the filler into the polymer matrix. The impacts of Al2O3 microballs on the thermal conductivity of the composites and the viscosity of pre-curing suspension were investigated. The viscosity increased slightly when a 20 vol. % of Al2O3 microballs were filled, and when the filling content reached 50 vol. %, the viscosity was still relatively lower than that of the epoxy with roughly spherical AlN granules. A high thermal conductivity of 2.70 W/(m·K) was achieved with an Al2O3 microball content of 60 vol. %.
Keywords
alumina; ceramics; composite materials; polymers; thermal conductivity; viscosity; Al2O3; alumina microball; ceramic particles; epoxy composites; polymer matrix; pre-curing suspension; superspherical structure; thermal conductivity; viscosity; Ceramics; Conductivity; Electronic packaging thermal management; Filling; Polymers; Thermal conductivity; Viscosity; alumina microballs; composite; thermalconductivity; viscosity;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2011 12th International Conference on
Conference_Location
Shanghai
Print_ISBN
978-1-4577-1770-3
Electronic_ISBN
978-1-4577-1768-0
Type
conf
DOI
10.1109/ICEPT.2011.6066859
Filename
6066859
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