DocumentCode
2184119
Title
Evaluation of techniques for bonding wires to quantized Hall resistors
Author
Lee, K.C.
Author_Institution
Dept. of Commerce, Nat. Inst. of Stand. & Technol., Gaithersburg, MD, USA
fYear
1994
fDate
June 27 1994-July 1 1994
Firstpage
112
Lastpage
113
Abstract
Three different techniques for mounting quantized Hall resistors with AuGe/Ni alloyed contacts were evaluated. The best quality and most robust samples were made by evaporating bonding pads that overlapped the alloyed contacts and the substrate, so that bonds could be made over the substrate rather than over the heterostructure.<>
Keywords
electrical contacts; lead bonding; metallisation; quantum Hall effect; resistors; AuGe-Ni; AuGe/Ni alloyed contacts; bonding pad evaporation; heterostructure; quantized Hall resistors; substrate; wire bonding; Bonding; Contact resistance; Gallium arsenide; Gold; NIST; Nickel alloys; Resistors; Soldering; Temperature; Wires;
fLanguage
English
Publisher
ieee
Conference_Titel
Precision Electromagnetic Measurements, 1994. Digest., 1994 Conference on
Conference_Location
Boulder, CO, USA
Print_ISBN
0-7803-1984-2
Type
conf
DOI
10.1109/CPEM.1994.333279
Filename
333279
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