Molecular dynamics simulation for the bonding energy of metal-SWNT interface

Author

Yahui Zhang ; Hu, Zhili ; Yan Zhang ; Ye, Lilei ; Liu, Johan

Author_Institution

Key Lab. of Adv. Displays & Syst. Applic., Shanghai Univ., Shanghai, China

fYear

2011

fDate

8-11 Aug. 2011

Firstpage

1

Lastpage

4

Abstract

For this paper, we carried out molecular dynamics simulation to calculate the bonding energy of the metal-SWNT interface. Three kinds of metal, namely iron, nickel and gold, were studied. The results show that the iron-SWNT interface has the strongest bonding energy, and then nickel and gold. To confirm these results, tensile loading tests were also performed to study the breaking force of the metal-SWNT interface. The force needed to debond the metal-SWNT interface is at the order of nano-newton. The more adhesion energy the interface has, the bigger force that must be loaded to break the joint.

Keywords

bonding processes; interface states; molecular dynamics method; nanotube devices; tensile testing; breaking force; metal SWNT interface; molecular dynamics simulation; strongest bonding energy; tensile loading tests; Bonding; Carbon nanotubes; Gold; Iron; Joints; Substrates;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2011 12th International Conference on

Conference_Location

Shanghai

Print_ISBN

978-1-4577-1770-3

Electronic_ISBN

978-1-4577-1768-0

Type

conf

DOI

10.1109/ICEPT.2011.6066886

Filename

6066886