Thermal management and characterization of the active component embedding into organic substrate

The reliability problem and the thermal management problem of active embedded component into organic substrate becomes a bottleneck restricting development. On the one hand, these paper overviews the thermal management features of the technology, the modeling of the thermal management and the application of thermal methods. It does the cooling and the thermal stress simulation analysis for typical materials and structures used in active embedded component into organic substrate using finite-element analysis. On the other hand, it analyses the thermal management issues of two common packages, wire bonding and flip chip of active embedded component into organic substrates. The flip chip approach has better cooling performance and other processing benefits over wire bonding. Active embedded technology is generally restricted to a power density which is less than 0.08W/mm2 in order to utilized natural convection cooling. The BT (Bismaleimide Triazine) resin material is more suitable for embedding active devices than is FR-4.