• DocumentCode
    2189311
  • Title

    Packaging and metallisation effects of valley microstrip line with slit for use in very small multilayer MMICs

  • Author

    Ao Sheng Rong ; Zhong Liang Sun

  • Author_Institution
    Dept. of Radio Eng., Southeast Univ., Nanjing, China
  • fYear
    1994
  • fDate
    23-27 May 1994
  • Firstpage
    1723
  • Abstract
    A comprehensive characterisation of valley microstrip lines with or without slits is proposed. When applied to very small multilayer MMICs, such new lines exhibit appreciable packaging and metallisation effects. Moreover, their characteristic parameters can be adjusted by changing the oblique angle and the slit width, which leads to flexible circuit design.<>
  • Keywords
    MMIC; integrated circuit technology; metallisation; microstrip lines; packaging; circuit design; metallisation; multilayer MMICs; packaging; slit; valley microstrip line; Circuit synthesis; MMICs; Metallization; Microstrip; Nonhomogeneous media; Packaging;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microwave Symposium Digest, 1994., IEEE MTT-S International
  • Conference_Location
    San Diego, CA, USA
  • ISSN
    0149-645X
  • Print_ISBN
    0-7803-1778-5
  • Type

    conf

  • DOI
    10.1109/MWSYM.1994.335108
  • Filename
    335108
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2189311