• DocumentCode
    2190095
  • Title

    Preparation and characterization of bulk nanoporous Sn and SnO2

  • Author

    Ahmad Shahar, Mohd Lutfi ; Rais, S.A.A. ; Wahid, M.H.A. ; Ahmad, M.F.

  • Author_Institution
    Sch. of Microelectron. Eng. (SoME), Univ. Malaysia Perlis (UniMAP), Arau, Malaysia
  • fYear
    2012
  • fDate
    5-6 Dec. 2012
  • Firstpage
    72
  • Lastpage
    77
  • Abstract
    EUV lithography has received much attention because of leading the next generation lithography for more compact, with node size as small as 40nm integrated circuit (IC) fabrication process. Additional, the EUV lithography has been extensively researched around the world for semiconductor future road map. Bulk nanoporous of Sn and SnO2 become reliable candidate to generate EUV lithography. This paper is focused on preparation and characterization of bulk nanoporous material of Sn and SnO2 to overcome debris problem. The sample was prepared by reaction solid-state of powder Sn without organic binder and SnO2 with organic binder with compacting and sintering process. The samples are characterized by morphology identification (SEM) and phase identification (XRD). The result is proposed as prospect for future EUV lithography research to get solid low plasma density target.
  • Keywords
    X-ray diffraction; nanofabrication; nanolithography; nanoporous materials; plasma density; porous semiconductors; scanning electron microscopy; semiconductor growth; sintering; tin; tin compounds; ultraviolet lithography; EUV lithography; SEM; Sn; SnO2; XRD; integrated circuit fabrication process; morphology identification; nanoporous materials; next generation lithography; organic binder; phase identification; plasma density; powders; sintering process; size 40 nm; Bulk nanoporous; EUV lithography; Sn and SnO2;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Research and Development (SCOReD), 2012 IEEE Student Conference on
  • Conference_Location
    Pulau Pinang
  • Print_ISBN
    978-1-4673-5158-4
  • Type

    conf

  • DOI
    10.1109/SCOReD.2012.6518614
  • Filename
    6518614