Efficient integrated DC-DC power converters - Advanced technologies and new challenges

Advanced circuit component, packaging, and thermal management technologies are critically evaluated for developing efficient integrated DC-DC power converters; and, important challenges and potential limitations are identified. It is shown that heterogeneous chip-scale integration of GaN power FETs, silicon CMOS control, integrated power inductors, and microchip capacitors using the new high-density, low-loss Quilt Packaging™ (QP) promises efficiency performance breakthroughs never seen before with integrated silicon DC-DC power converter chips. Thermal constraints arising from the heating of GaN power FETs and integrated chip-scale power inductors not only require advanced cooling, but also will ultimately limit the scalability, performance, and reliability of this important emerging technology.