DocumentCode
2192644
Title
Proceedings 1997 IEEE Multi-Chip Module Conference
fYear
1997
fDate
4-5 Feb. 1997
Abstract
The following topics were dealt with: flip-chip; mixed-signal MCMs; MCM design and CAD; single-chip and multi-chip integration; interconnect analysis and simulation; test, technology and infrastructure; optical MCMs
Keywords
multichip modules; CAD; MCM design; flip-chip; infrastructure; interconnect analysis; mixed-signal MCMs; multi-chip integration; multi-chip modules; optical MCMs; simulation; single-chip integration; technology; test;
fLanguage
English
Publisher
ieee
Conference_Titel
Multi-Chip Module Conference, 1997. MCMC '97., 1997 IEEE
Conference_Location
Santa Cruz, CA, USA
Print_ISBN
0-8186-7789-9
Type
conf
DOI
10.1109/MCMC.1997.569336
Filename
569336
Link To Document