Thickness measurement for Cu and Ta thin films using optoacoustics

Author

Gostein, M. ; Bailey, T.C. ; Emesh, I. ; Diebold, A.C. ; Maznev, A.A. ; Banet, M. ; Joffe, M. ; Sacco, R.

Author_Institution

Philips Anal., Natick, MA, USA

fYear

2000

fDate

2000

Firstpage

176

Lastpage

178

Abstract

New all-optical, nondestructive metrology instruments for metal film thickness measurement have been developed using the opto-acoustic technique impulsive stimulated thermal scattering (ISTS). The technique uses lasers to initiate and detect acoustic waves in the sample film. In this study, a commercial ISTS-based instrument is evaluated for measuring Cu and Ta thin films, and the results are compared with 4-point probe, SEM, TEM, and GIXR. We also show that ISTS can be used in conjunction with 4-point-probe to determine resistivity for thin PVD Cu films

Keywords

copper; electrical resistivity; measurement by laser beam; metallic thin films; photoacoustic spectra; tantalum; thickness measurement; 4-point-probe; Cu; Ta; impulsive stimulated thermal scattering; nondestructive metrology; optoacoustics; resistivity; thickness measurement; thin films; Acoustic measurements; Acoustic scattering; Acoustic signal detection; Acoustic waves; Conductivity; Instruments; Metrology; Probes; Thickness measurement; Transistors;

fLanguage

English

Publisher

ieee

Conference_Titel

Interconnect Technology Conference, 2000. Proceedings of the IEEE 2000 International

Conference_Location

Burlingame, CA

Print_ISBN

0-7803-6327-2

Type

conf

DOI

10.1109/IITC.2000.854317

Filename

854317