Antenna-in-package solutions for 60 GHz communication links

Two multilayer technologies have been used two introduce antenna-in-package solutions for millimeter wave applications such as multi-gigabit-per-second communication transceivers. The first technology is a commercially available PCB technology incorporating microwave-compatible laminates yielding acceptable losses at high frequencies. The second technology is a thin-film Silicon-based one using some advanced micro-machining capabilities to implement the antenna-in-package solution. Both of them are compared for their simulation and measurement results followed by discussions on how efficient they are to be used for the 60 GHz application.