DocumentCode
2194590
Title
A novel MMIC coupler-measured and simulated data
Author
Mernyei, F. ; Aoki, I. ; Matsuura, H.
Author_Institution
Dept. of Res. & Dev., Teratec Corp., Tokyo, Japan
fYear
1994
fDate
23-27 May 1994
Firstpage
229
Abstract
This paper presents wafer measurements and parameter extraction on a Broadside-Offset-Coupled Coplanar-Microstrip (BOC-CPW-MS) coupler. This passive structure was fabricated by using multilayer MMIC technology which allows us to realize couplers with various coupling values, controlled by its geometry. The control of the coupling in the -3 to -30 dB range with a 100% bandwidth at 30 GHz center frequency was achieved.<>
Keywords
MMIC; equivalent circuits; microstrip components; waveguide couplers; 30 GHz; CPW; MMIC coupler; broadside-offset-coupled type; coplanar-microstrip coupler; multilayer MMIC technology; parameter extraction; passive structure; wafer measurements; Bandwidth; Frequency; Geometry; MMICs; Nonhomogeneous media; Parameter extraction;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave Symposium Digest, 1994., IEEE MTT-S International
Conference_Location
San Diego, CA, USA
ISSN
0149-645X
Print_ISBN
0-7803-1778-5
Type
conf
DOI
10.1109/MWSYM.1994.335330
Filename
335330
Link To Document