Extending the three-dimensional spectral-domain approach to hybrid microwave integrated circuits with passive and active lumped elements

Author

Tzyy-Sheng Horng

Author_Institution

Dept. of Electr. Eng., Nat. Sun Yat-Sen Univ., Kaohsiung, Taiwan

fYear

1994

fDate

23-27 May 1994

Firstpage

709

Abstract

This paper extends the spectral-domain approach (SDA) to rigorously analyze hybrid microwave integrated circuits (HMIC) with lumped elements such as resistors, inductors, capacitors, diodes and transistors. Via-holes and air-bridges are used to connect these elements and attach them to the planar metallization structures. Under this scheme, the electric field integral equations that include linear elements are derived and solved through the method of moments. In addition, an iterative technique for assistance in modeling nonlinear elements is described. Comparison of SDA results with MWSPICE and TOUCHSTONE calculations for several practical circuit configurations illustrates the accuracy of this extended SDA method.<>

Keywords

hybrid integrated circuits; integral equations; iterative methods; lumped parameter networks; microwave integrated circuits; numerical analysis; spectral-domain analysis; active lumped elements; air-bridges; capacitors; diodes; electric field integral equations; hybrid microwave integrated circuits; inductors; iterative technique; linear elements; method of moments; nonlinear elements; passive lumped elements; planar metallization structures; resistors; three-dimensional spectral-domain approach; transistors; via-holes; Capacitors; Diodes; Hybrid integrated circuits; Inductors; Integral equations; Metallization; Microwave integrated circuits; Microwave transistors; Moment methods; Resistors;

fLanguage

English

Publisher

ieee

Conference_Titel

Microwave Symposium Digest, 1994., IEEE MTT-S International

Conference_Location

San Diego, CA, USA

ISSN

0149-645X

Print_ISBN

0-7803-1778-5

Type

conf

DOI

10.1109/MWSYM.1994.335523

Filename

335523