DocumentCode
2197684
Title
A novel concept for MM-wave MMIC interconnects and packaging
Author
Strauss, G. ; Menzel, W.
Author_Institution
Microwave Techniques, Ulm Univ., Germany
fYear
1994
fDate
23-27 May 1994
Firstpage
1141
Abstract
Standard interconnect and packaging techniques for MMICs tend to get more and more difficult at MM-wave frequencies due to the increased influence of discontinuities and tolerances, especially in conjunction with temperature and hermetic sealing. To overcome these problems, a novel concept is proposed based on electromagnetic field coupling for interconnects and package feed-through elements. First theoretical and (scaled) experimental results are presented.<>
Keywords
MMIC; integrated circuit technology; packaging; MIMIC; MM-wave MMIC interconnects; electromagnetic field coupling; package feed-through elements; packaging techniques; Electromagnetic coupling; Electromagnetic fields; Frequency; MMICs; Packaging; Temperature;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave Symposium Digest, 1994., IEEE MTT-S International
Conference_Location
San Diego, CA, USA
ISSN
0149-645X
Print_ISBN
0-7803-1778-5
Type
conf
DOI
10.1109/MWSYM.1994.335545
Filename
335545
Link To Document