• DocumentCode
    2197752
  • Title

    New high density micro structured thermogenerators for stand alone sensor systems

  • Author

    Bottner, H. ; Nurnus, J. ; Schubert, A. ; Volkert, F.

  • Author_Institution
    Dept. for Thermoelectr. Syst., Fraunhofer Inst. for Phys. Meas. Tech. IPM, Freiburg
  • fYear
    2007
  • fDate
    3-7 June 2007
  • Firstpage
    306
  • Lastpage
    309
  • Abstract
    Thermoelectric thin film micro-devices with high packing densities of thermoelectric legs are of high demand in micro-systems for self-standing and so called waste energy self-powered sensor systems for wireless data transfer. One technical solution for such micro-devices is offered by the Micropelt technology. The recent development status of the Micropelt micro thermogenerators will be presented. The Micropelt platform technology now allows devices with up to ~8000 p-n-couples per cm2. Open circuit voltages achieved so far were about 2.3 V at 10 K temperature difference. Maximum power output was measured to be 2.8 mW. Thus they are suited as power supplies for harvesting energy in stand alone sensor systems for wireless data transmission. An evaluation setup to perform first level tests for the efficiency of harvesting waste energy using the microstructured thermogenerators will be presented.
  • Keywords
    microsensors; thermoelectric devices; Micropelt micro thermogenerators; Micropelt platform technology; high density microstructured thermogenerators; stand alone sensor systems; thermoelectric legs; thermoelectric thin film micro-devices; voltage 2.3 V; waste energy self-powered sensor systems; wireless data transfer; Circuits; Leg; Power measurement; Power supplies; Sensor systems; Temperature sensors; Thermoelectricity; Thin film sensors; Voltage; Wireless sensor networks;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermoelectrics, 2007. ICT 2007. 26th International Conference on
  • Conference_Location
    Jeju Island
  • ISSN
    1094-2734
  • Print_ISBN
    978-1-4244-2262-3
  • Electronic_ISBN
    1094-2734
  • Type

    conf

  • DOI
    10.1109/ICT.2007.4569484
  • Filename
    4569484