• DocumentCode
    2198899
  • Title

    Influence of Threshold Voltage Deviations on 90nm SRAM Core-Cell Behavior

  • Author

    Bastian, M. ; Gouin, V. ; Girard, P. ; Landrault, C. ; Ney, A. ; Pravossoudovitch, S. ; Virazel, A.

  • Author_Institution
    Infineon Technol. France, Sophia-Antipolis
  • fYear
    2007
  • fDate
    8-11 Oct. 2007
  • Firstpage
    507
  • Lastpage
    510
  • Abstract
    Nanoscaled SRAMs are now becoming more and more prone to device parameter deviations. In this paper, we consider threshold voltage (Vt) deviations in 6T core-cells designed with 90 nm technology. Static faults (transition and read destructive) but also dynamic faults (dynamic read destructive) are obtained as resulting faulty behaviors. Moreover, electrical data show that PVT (process, voltage, temperature) corners that maximize the detection of these faults are quite unconventional. Especially, we show that Vt deviations have their main impact at low voltage while hard defects, such as resistive-open defects in the core-cell, better manifest themselves at high voltage. This study of parameter deviations opens an additional problematic for the test of nanoscaled SRAMS that will be much more severe in deeper technologies (65 nm and 45 nm).
  • Keywords
    SRAM chips; fault diagnosis; integrated circuit design; integrated circuit testing; logic design; logic testing; nanoelectronics; Vt deviations; fault detection; nanoscaled SRAM 6T core-cell design; size 90 nm; threshold voltage deviation; Circuit faults; Failure analysis; Fluctuations; Geometry; Low voltage; Manufacturing; Random access memory; Temperature; Testing; Threshold voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Asian Test Symposium, 2007. ATS '07. 16th
  • Conference_Location
    Beijing
  • ISSN
    1081-7735
  • Print_ISBN
    978-0-7695-2890-8
  • Type

    conf

  • DOI
    10.1109/ATS.2007.121
  • Filename
    4388065