DocumentCode
2198899
Title
Influence of Threshold Voltage Deviations on 90nm SRAM Core-Cell Behavior
Author
Bastian, M. ; Gouin, V. ; Girard, P. ; Landrault, C. ; Ney, A. ; Pravossoudovitch, S. ; Virazel, A.
Author_Institution
Infineon Technol. France, Sophia-Antipolis
fYear
2007
fDate
8-11 Oct. 2007
Firstpage
507
Lastpage
510
Abstract
Nanoscaled SRAMs are now becoming more and more prone to device parameter deviations. In this paper, we consider threshold voltage (Vt) deviations in 6T core-cells designed with 90 nm technology. Static faults (transition and read destructive) but also dynamic faults (dynamic read destructive) are obtained as resulting faulty behaviors. Moreover, electrical data show that PVT (process, voltage, temperature) corners that maximize the detection of these faults are quite unconventional. Especially, we show that Vt deviations have their main impact at low voltage while hard defects, such as resistive-open defects in the core-cell, better manifest themselves at high voltage. This study of parameter deviations opens an additional problematic for the test of nanoscaled SRAMS that will be much more severe in deeper technologies (65 nm and 45 nm).
Keywords
SRAM chips; fault diagnosis; integrated circuit design; integrated circuit testing; logic design; logic testing; nanoelectronics; Vt deviations; fault detection; nanoscaled SRAM 6T core-cell design; size 90 nm; threshold voltage deviation; Circuit faults; Failure analysis; Fluctuations; Geometry; Low voltage; Manufacturing; Random access memory; Temperature; Testing; Threshold voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Asian Test Symposium, 2007. ATS '07. 16th
Conference_Location
Beijing
ISSN
1081-7735
Print_ISBN
978-0-7695-2890-8
Type
conf
DOI
10.1109/ATS.2007.121
Filename
4388065
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