• DocumentCode
    2200336
  • Title

    Simulation of temperature distribution on a spherical target during plasma immersion ion implantation

  • Author

    Tian, X. ; Chu, P.K. ; Zeng, X. ; Leng, Y. ; Tat-Kun Kwok, D. ; Tang, B.

  • Author_Institution
    Dept. of Phys. & Mater. Sci., City Unig. of Hong Kong, Kowloon, China
  • fYear
    2000
  • fDate
    4-7 June 2000
  • Firstpage
    101
  • Abstract
    Summary form only given. Ion implantation has been shown to be an effective surface modification technique without sacrificing the bulk properties. The modification results are, however, influenced not only by the implantation voltage, incident dose, but also the treatment temperature, particularly in elevated temperature ion implantation into metals with lower temper temperature. During the treatment, both the sample temperature and its history contribute to the final surface properties. In this paper, we investigate the temperature distribution on a spherical target during plasma immersion ion implantation (PIII) using numerical simulation. The majority of the heat input into the target is shown to originate from the energetic ions accelerated by a plasma sheath. Our simulation results also demonstrate that the implantation voltage, pulsing frequency, pulse duration and plasma density exert different influence on the temperature rising rate in addition to the equilibrium temperature. The influence of the target size is also simulated, since it critically affects the heating and cooling characteristics of the process. Our model is important to the understanding of the local temperature variation and heating rate of both planar and nonplanar samples during plasma immersion ion implantation.
  • Keywords
    cooling; digital simulation; heating; ion implantation; plasma density; plasma materials processing; plasma simulation; temperature distribution; bulk properties; cooling characteristics; elevated temperature ion implantation; energetic ions; equilibrium temperature; heat input; heating characteristics; heating rate; implantation voltage; incident dose; local temperature variation; nonplanar samples; numerical simulation; planar samples; plasma density; plasma immersion ion implantation; pulse duration; pulsing frequency; sample temperature; spherical target; surface modification; surface properties; target size; temper temperature; temperature distribution; temperature rising rate; treatment temperature; Acceleration; Heating; History; Ion implantation; Numerical simulation; Plasma immersion ion implantation; Plasma temperature; Surface treatment; Temperature distribution; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Plasma Science, 2000. ICOPS 2000. IEEE Conference Record - Abstracts. The 27th IEEE International Conference on
  • Conference_Location
    New Orleans, LA, USA
  • ISSN
    0730-9244
  • Print_ISBN
    0-7803-5982-8
  • Type

    conf

  • DOI
    10.1109/PLASMA.2000.854646
  • Filename
    854646