RF MEMS and Si micromachining in high frequency applications

Author

Peroulis, Dimitrios ; Margomenos, Alexandros ; Katehi, Linda P B

Author_Institution

Comput. Sci. Dept., Michigan Univ., Ann Arbor, MI, USA

fYear

2002

fDate

2002

Firstpage

265

Lastpage

268

Abstract

RF MEMS and Si micromachining are key technologies in obtaining low-size, low-weight, and low-cost components for the coming generation of communications systems. These technologies allow both the development of high-performance microwave/millimeter-wave switches and switch-based tunable subsystems, as well as innovative and efficient architectures for interconnecting and packaging. The design of a low-voltage capacitive and a low-resistance DC-contact switch are discussed. We also focus on a broadband low-loss on-wafer packaging scheme developed for the capacitive MEMS switch.

Keywords

micromachining; micromechanical devices; microwave switches; packaging; silicon; 0.70 ohm; 40 GHz; 9 V; HF applications; RF MEMS; Si; broadband low-loss on-wafer packaging; capacitive MEMS switch; communications systems; efficient architecture; high frequency applications; innovative architecture; interconnection architecture; low-cost components; low-voltage capacitive DC-contact switch; low-weight components; microwave/millimeter-wave switches; silicon micromachining; switch-based tunable subsystems; Application software; Circuits; Micromechanical devices; Microswitches; Microwave technology; Packaging; Radio frequency; Radiofrequency microelectromechanical systems; Switches; Voltage;

fLanguage

English

Publisher

ieee

Conference_Titel

Radio and Wireless Conference, 2002. RAWCON 2002. IEEE

Print_ISBN

0-7803-7458-4

Type

conf

DOI

10.1109/RAWCON.2002.1030168

Filename

1030168