DocumentCode
2204633
Title
Progress in development of advanced package for semiconductor device
Author
Zheng, Hongyu ; Gao, Ling ; Liu, Zhiping
Author_Institution
Hebei Semicond. Res. Inst., China
Volume
1
fYear
2001
fDate
2001
Firstpage
83
Abstract
This paper summarizes the progress in development of advanced packaging for semiconductor devices in our lab of HSRI during the past years. The main scope will deal with the achievement of packaging basic research and various packaging products for discrete devices, IC, MEMS and optoelectronics devices
Keywords
ball grid arrays; ceramic packaging; integrated circuit packaging; micromechanical devices; multichip modules; optoelectronic devices; semiconductor device packaging; BGA; IC packaging; MCM; MEMS; PGA; advanced packaging; ceramic packaging; discrete devices; low dielectric constant material; microwave device package; optoelectronic devices; package design; packaging CAD; semiconductor device; Ceramics; Electronic packaging thermal management; Electronics packaging; Integrated circuit packaging; Metallization; Micromechanical devices; Optical devices; Semiconductor device packaging; Semiconductor devices; Thermal conductivity;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State and Integrated-Circuit Technology, 2001. Proceedings. 6th International Conference on
Conference_Location
Shanghai
Print_ISBN
0-7803-6520-8
Type
conf
DOI
10.1109/ICSICT.2001.981430
Filename
981430
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