A new structure for measuring the thermal conductivity of thin film

Author

Song, Qinglin ; Xia, Shanhong ; Chen, Shaofeng ; Cui, Zheng

Author_Institution

State Key Lab. of Transducer Technol., Chinese Acad. of Sci., Beijing, China

fYear

2004

fDate

21-25 June 2004

Firstpage

77

Lastpage

79

Abstract

A new microdevice for measuring the thermal conductivity of thin film is presented. It is based on the static-state method, which is widely used and a simple technique for measuring the lateral thermal conductivity of thin film. The device is fabricated using micromachining process, which is 800×2000μm bridge membrane with 30×100μm beams. The heater and thermometer across the bridge membrane through the beams are used to create heat flux and to measure the temperature. On the membrane, heat flux is very uniform and the temperature is evenly distributed, which has been verified by simulation, making the system error smaller than conventional rectangular structure. Silicon nitride thin films with thickness from 0.5μm to 2μm have been investigated using the technique. The measurement result supports the size effect of the thermal conductivity for thin film.

Keywords

temperature measurement; thermal conductivity; thermal conductivity measurement; thermometers; thin films; heat flux; heater; microdevice; micromachining; silicon nitride thin film; static-state method; temperature measurement; thermal conductivity measurement; thermometer; Biomembranes; Bridges; Conductivity measurement; Micromachining; Semiconductor thin films; Silicon; Size measurement; Temperature measurement; Thermal conductivity; Transistors;

fLanguage

English

Publisher

ieee

Conference_Titel

Information Acquisition, 2004. Proceedings. International Conference on

Print_ISBN

0-7803-8629-9

Type

conf

DOI

10.1109/ICIA.2004.1373323

Filename

1373323