Polylithic integration of SAW devices using quartz-on-silicon process for true single chip radio

Author

Ku, Yeonwoo ; Eo, Yunseong ; Lee, Kwyro

Author_Institution

Dept. EECS, Korea Adv. Inst. of Sci. & Technol., Taejon, South Korea

Volume

1

fYear

2001

fDate

2001

Firstpage

236

Abstract

Presents the performance of DTCSO (digitally temperature-compensated SAW oscillator) using PLIC (polylithic integrated circuit) technology on quartz-on-silicon wafer. A prototype DTCSO reference oscillator is designed and fabricated on a QoS wafer and shows the phase noise performance -115 dBc/Hz at 10 kHz offset, 7.5 mW power consumption. The frequency stability performance of 4.5 ppm is very comparable with that of bulk crystal TCXO, demonstrating the feasibility of integration of reference oscillator for high performance true single chip radio

Keywords

CMOS integrated circuits; Q-factor; compensation; frequency stability; phase noise; radiofrequency oscillators; surface acoustic wave oscillators; switched capacitor networks; 7.5 mW; DTCSO; PLIC; SAW devices; SiO₂-Si; digitally temperature-compensated SAW oscillator; frequency stability performance; phase noise performance; polylithic integration; power consumption; quartz-on-silicon process; true single chip radio; Circuit stability; Digital integrated circuits; Energy consumption; Frequency; Integrated circuit technology; Oscillators; Phase noise; Prototypes; Surface acoustic wave devices; Surface acoustic waves;

fLanguage

English

Publisher

ieee

Conference_Titel

Solid-State and Integrated-Circuit Technology, 2001. Proceedings. 6th International Conference on

Conference_Location

Shanghai

Print_ISBN

0-7803-6520-8

Type

conf

DOI

10.1109/ICSICT.2001.981463

Filename

981463