• DocumentCode
    2206849
  • Title

    PTC Effect and Structure of Polymer Composites Based on Polypropylene/Co-Polyamide Blend Filled with Dispersed Iron

  • Author

    Kanapitsas, A. ; Tsonos, C. ; Logakis, E. ; Pandis, C. ; Pissis, P. ; Kontou, E. ; Mamunya, Y.P. ; Lebedev, E.V. ; Delides, C.G.

  • Author_Institution
    Technol. Educational Inst. of Lamia, Dept. of Electron., Athens
  • fYear
    0
  • fDate
    0-0 0
  • Firstpage
    363
  • Lastpage
    366
  • Abstract
    The temperature dependence of resistivity, structure and thermal expansion of composites based on polymer blend polypropylene/co-polyamide (PP/CPA) filled with dispersed iron (Fe) has been studied. The dependence of conductivity on filler content shows percolation behavior with the values of the percolation thresholds equal to 5 vol.% for the filled blend PP/CPA-Fe with two steps character of the conductivity curve. The evolution of structure of the composite PP/CPA-Fe demonstrates transition from polymer matrix CPA-Fe with inclusions of PP through co-continuous phases of both CPA-Fe and PP to PP matrix with inclusions of CPA-Fe. Such a structure occurs due to localisation of the filler only in one of the polymer phases, namely in CPA. The PP/CPA-Fe composites demonstrate PTC effect with the presence of a resistivity plateau. In such a system the PTC is caused by the break of the conductive structure of the filler inside the CPA-Fe phase due to the morphological changes in the vicinity of the melting temperature of CPA
  • Keywords
    filled polymers; iron; polymer blends; thermal conductivity; thermal expansion; thermal resistance; Fe; PTC effect; conductivity curve; dispersed iron; percolation thresholds; polymer blend; polymer composites; polymer matrix CPA-Fe; polypropylene/co-polyamide blend; temperature dependence; thermal expansion; Composite materials; Conductivity; Dispersion; Iron; Polymers; Powders; Temperature dependence; Temperature sensors; Thermal expansion; Viscosity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microelectronics, 2006 25th International Conference on
  • Conference_Location
    Belgrade
  • Print_ISBN
    1-4244-0117-8
  • Type

    conf

  • DOI
    10.1109/ICMEL.2006.1650975
  • Filename
    1650975