• DocumentCode
    2206939
  • Title

    Charging damage in metal-oxide-metal capacitors

  • Author

    Harris, E.B. ; Gregor, R.W. ; Dennis, D.C. ; Lai, T.T. ; Sen, S. ; Yan, Y.F. ; Esry, T. ; Pita, M.

  • Author_Institution
    Lucent Technol., AT&T Bell Labs., Orlando, FL, USA
  • fYear
    1998
  • fDate
    4-5 Jun 1998
  • Firstpage
    15
  • Lastpage
    17
  • Abstract
    The magnetically enhanced reactive ion etching (MERIE) process is well known for causing charging damage to thin gate oxide. Damage to thin gate oxide by the Ar fillet process has been documented (Stamper et al., 1995). In this paper, charging damage to metal-oxide-metal (MOM) capacitors, often used in analog circuits, is reported. The dielectrics in these MOM capacitors are much thicker than gate oxides and the antenna ratios are typically near unity. One therefore does not expect these capacitors to suffer from charging damage easily. However, we found these MOM capacitors to be very sensitive to charging damage. We argue that the sensitivity of these capacitors is actually not surprising. Thicker oxides require higher voltage but less current to breakdown. Since antennae act as current amplifiers, thicker oxide does not require a large antenna ratio to become damaged as long as the plasma can supply the voltage. In addition, the dielectric in MOM capacitors is not of the same quality as gate oxides and therefore is more prone to damage
  • Keywords
    MIM devices; analogue integrated circuits; dielectric thin films; integrated circuit reliability; integrated circuit testing; plasma materials processing; sputter etching; thin film capacitors; AlCuSi-SiO2-TiN; MERIE process; MOM capacitor gate oxides; MOM capacitors; analog circuits; antenna ratio; antenna ratios; antenna structure current amplifier action; breakdown current; breakdown voltage; capacitor charging damage sensitivity; charging damage; dielectrics; gate oxides; magnetically enhanced RIE process; magnetically enhanced reactive ion etching process; metal-oxide-metal capacitors; oxide antenna ratio; plasma etching; plasma voltage; thin gate oxide charging damage; Argon; Breakdown voltage; Capacitors; Circuits; Dielectrics; Etching; Magnetic fields; Message-oriented middleware; Plasma applications; Testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Plasma Process-Induced Damage, 1998 3rd International Symposium on
  • Conference_Location
    Honolulu, HI
  • Print_ISBN
    0-9651577-2-5
  • Type

    conf

  • DOI
    10.1109/PPID.1998.725563
  • Filename
    725563