• DocumentCode
    2207560
  • Title

    Cross-layer interaction management: A modularity consideration

  • Author

    Guo, Hua ; Ye, Wu ; Feng, Suili ; Zhuang, Hongcheng

  • Author_Institution
    Sch. of Electron. & Inf. Eng., South China Univ. of Technol., Guangzhou, China
  • fYear
    2008
  • fDate
    19-21 Nov. 2008
  • Firstpage
    732
  • Lastpage
    736
  • Abstract
    Cross-layer interaction is an indispensable part of cross-layer design, which has been proved to greatly improve the performance of wireless networks. In this paper, a scheme for cross-layer interaction management (CLIM) is proposed. It has the following distinct advantages. Firstly, CLIM achieves efficiency by considering the modularity of protocol stack. Secondly, in CLIM, implementing cross-layer interaction is more flexible than before, because the way to access a layer¿s inner variable can be chosen freely, and will no longer be restricted to specific method like data sharing or signaling. Thirdly, CLIM maintains the good architecture of the wireless protocol stack by using DSA and message queue mechanism to manage the cross-layer interactions. CLIM can be amalgamated with 802.16 signalling system so as to make possible the use of multiple cross-layer designs in a 802.16 terminal.
  • Keywords
    WiMax; protocols; 802.16 signalling system; cross-layer interaction management; data sharing; modularity consideration; multiple cross-layer designs; protocol stack modularity; wireless networks; wireless protocol stack; Access protocols; Cross layer design; Design engineering; Engineering management; Proposals; Signal design; Technology management; Transport protocols; Wireless application protocol; Wireless networks; 802.16; CLIM; DSA; WiMax; cross-layer design; cross-layer interaction; modularity; protocol stack;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Communication Systems, 2008. ICCS 2008. 11th IEEE Singapore International Conference on
  • Conference_Location
    Guangzhou
  • Print_ISBN
    978-1-4244-2423-8
  • Electronic_ISBN
    978-1-4244-2424-5
  • Type

    conf

  • DOI
    10.1109/ICCS.2008.4737282
  • Filename
    4737282