Challenges facing the semiconductor equipment industry low pressure plasma processing

Author

Tobin, J.

Author_Institution

Novellus Syst. Inc., San Jose, CA, USA

fYear

2002

fDate

26-30 May 2002

Firstpage

215

Abstract

Summary form only given, as follows. This talk will focus on how the semiconductor capital equipment companies working with the plasma processing research community can meet the challenges of plasma applications of the next semiconductor device generations. A review of the current and future of the industry as it relates to plasma processing will be presented. Also, the shifting responsibilities of the IC manufacturers, the equipment suppliers and the plasma research community will be discussed.

Keywords

integrated circuit manufacture; plasma deposition; plasma materials processing; plasma sources; semiconductor device manufacture; semiconductor technology; IC manufacturers; capital equipment companies; dielectric gap fill processes; equipment suppliers; interlevel dielectrics; low pressure plasma processing; metallization; next generation semiconductor devices; plasma deposition; plasma research community; plasma source development; plasma source geometry; reactor geometry; semiconductor equipment industry; wafer size; Electronics industry; Manufacturing industries; Metallization; Plasma applications; Plasma density; Plasma devices; Plasma materials processing; Plasma sources; Plasma stability; Semiconductor device manufacture;

fLanguage

English

Publisher

ieee

Conference_Titel

Plasma Science, 2002. ICOPS 2002. IEEE Conference Record - Abstracts. The 29th IEEE International Conference on

Conference_Location

Banff, Alberta, Canada

Print_ISBN

0-7803-7407-X

Type

conf

DOI

10.1109/PLASMA.2002.1030460

Filename

1030460