• DocumentCode
    2209310
  • Title

    Plasma processing with plasmas based on electron beam ionization

  • Author

    Leonhardt, Darin ; Balkey, M.M. ; Walton, S.G. ; Blackwell, D.D. ; Murphy, D.P. ; Fernsler, R.F. ; Meger, R.A.

  • Author_Institution
    Plasma Phys. Div., U.S. Naval Res. Lab., Washington, DC, USA
  • fYear
    2002
  • fDate
    26-30 May 2002
  • Firstpage
    217
  • Abstract
    Summary form only given. Non-equilibrium (T/sub e/>>T/sub ion, gas/) plasma processing has become a vital component in the fabrication of many complex materials and devices. The versatility of such ´dry´ processes allows greater freedom and therefore opportunity for dramatic results in the areas of thin film development and surface modification. At NRL, a ´Large Area Plasma Processing System´ has been developed based on the high energy electron beam (e-beam) ionization process, with the goal of modifying the surface properties of materials over large areas (/spl sim/1 square meter). In addition to the large area capabilities, attributes of these plasmas which are attractive for materials´ modification are high plasma density (n/sub e//spl ges/10/sup 11/ cm/sup -3/), low electron temperature, a well defined plasma region (and therefore independence of chamber design) and independence of gas composition, all of which have been discussed previously. In this presentation, e-beam generated plasmas are discussed in terms of (1) applications (polymer modification, semiconductor etching), (2) geometries (planar sheets and electrodes, volumetric sources, separable beam sources) and (3) their advantages (low temperatures, variable ion and neutral compositions) from a surface point-of-view. Demonstration of these attributes will be shown through specific surface modifications and measured surface fluxes. Corresponding gas phase measurements will also be discussed as applicable.
  • Keywords
    electron impact ionisation; plasma collision processes; plasma materials processing; plasma-beam interactions; chamber design; dry processes; electrodes; electron beam ionization; electron temperature; fabrication; gas composition; gas phase measurements; high energy electron beam ionization process; large area plasma processing system; nonequilibrium plasma processing; planar sheets; plasma region; polymer modification; semiconductor etching; separable beam sources; surface fluxes; surface modifications; surface properties modification; volumetric sources; Electron beams; Ionization; Plasma applications; Plasma density; Plasma devices; Plasma materials processing; Plasma measurements; Plasma properties; Plasma sources; Plasma temperature;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Plasma Science, 2002. ICOPS 2002. IEEE Conference Record - Abstracts. The 29th IEEE International Conference on
  • Conference_Location
    Banff, Alberta, Canada
  • Print_ISBN
    0-7803-7407-X
  • Type

    conf

  • DOI
    10.1109/PLASMA.2002.1030464
  • Filename
    1030464