DocumentCode
2210872
Title
Microfabrication and Characterization of SiO2 Microcantilever for High Sensitive Moisture Sensor
Author
Chen, Qi ; Fang, Ji ; Ji, Hai-Feng ; Varahramyan, Kody
Author_Institution
Louisiana Tech Univ., Ruston
fYear
2007
fDate
28-31 Oct. 2007
Firstpage
1436
Lastpage
1439
Abstract
As an outstanding sensor platform, surface-stress sensing microcantilevers have potential application in moisture detection. To enlarge the deflection of the microcantilever under surface stress induced by specific reactions, a new SiO2 microcantilever is developed which features a much lower Young´s modulus than conventional Si or SiNx microcantilevers. For comparing SiO2 cantilever with Si cantilevers, simulation of the cantilever sensor is given, resulting in good agreement with the experimental data. To fabricate this device, a new fabrication process using isotropic combined with anisotropic dry etching to release the SiO2 microcantilever beam by ICP (inductively coupled plasma) was developed and investigated. Attributed to the high sensitivity, significant deflection amplitude of the surface modified SiO2 microcantilever was observed upon exposure to one percentage relative humidity.
Keywords
Young´s modulus; cantilevers; etching; humidity sensors; moisture; silicon compounds; SiO2; Young modulus; anisotropic dry etching; high sensitive moisture sensor; inductively coupled plasma; microcantilever deflection; moisture detection; relative humidity; surface-stress sensor; Anisotropic magnetoresistance; Dry etching; Fabrication; Moisture; Optical coupling; Particle beams; Plasma applications; Sensor phenomena and characterization; Silicon compounds; Stress;
fLanguage
English
Publisher
ieee
Conference_Titel
Sensors, 2007 IEEE
Conference_Location
Atlanta, GA
ISSN
1930-0395
Print_ISBN
978-1-4244-1261-7
Electronic_ISBN
1930-0395
Type
conf
DOI
10.1109/ICSENS.2007.4388683
Filename
4388683
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