• DocumentCode
    2211006
  • Title

    Circuit model of a SiGe HBT flip-chip mounted onto a silicon carrier

  • Author

    Norling, Martin ; Gevorgian, Spartak

  • Author_Institution
    Dept. of Microtechnology & Nanoscience, Chalmers Univ. of Technol., Gothenburg
  • fYear
    2006
  • fDate
    11-13 June 2006
  • Lastpage
    380
  • Abstract
    This paper reports the circuit model of a SiGe HBT transistor flip chipped onto a high-resistivity silicon carrier (substrate). It includes the parasitic capacitances and inductances associated with bumps, the flipped transistor chip and takes into account the effect of the high-permittivity ferroelectric film deposited on the silicon carrier
  • Keywords
    Ge-Si alloys; bipolar integrated circuits; elemental semiconductors; ferroelectric thin films; flip-chip devices; heterojunction bipolar transistors; integrated circuit modelling; permittivity; silicon; SiGe; SiGe HBT flip-chip; SiGe HBT transistor; circuit model; high-permittivity ferroelectric film; high-resistivity silicon carrier; parasitic capacitances; parasitic inductances; Circuits; Conductivity; Ferroelectric films; Germanium silicon alloys; Gold; Heterojunction bipolar transistors; Microwave transistors; Silicon germanium; Substrates; Temperature;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Radio Frequency Integrated Circuits (RFIC) Symposium, 2006 IEEE
  • Conference_Location
    San Francisco, CA
  • Print_ISBN
    0-7803-9572-7
  • Type

    conf

  • DOI
    10.1109/RFIC.2006.1651170
  • Filename
    1651170