Predictive High Frequency effects of substrate coupling in 3D integrated circuits stacking

Author

Eid, E. ; Lacrevaz, T. ; de Rivaz, S. ; Bermond, C. ; Fléchet, B. ; Calmon, F. ; Gontrand, C. ; Farcy, A. ; Cadix, L. ; Ancey, P.

Author_Institution

IMEP-LAHC, Univ. de Savoie, Le Bourget du Lac, France

fYear

2009

fDate

28-30 Sept. 2009

Firstpage

1

Lastpage

6

Abstract

In 3D integrated circuits, substrate coupling effects due to propagation of high frequency (HF) parasitic signals are carried by through silicon vias (TSV). These electrical coupling leads to several impacts on performance of 3D circuits. In this paper, predictive HF electrical simulations are achieved by full wave analysis in order to make obvious the coupling effect due to TSVs presence. Solutions to reduce substrate coupling are proposed and discussed.

Keywords

electronic engineering computing; integrated circuit layout; 3D integrated circuits stacking; electrical coupling; high frequency parasitic signals; predictive high frequency effects; substrate coupling effects; through silicon vias; Analytical models; Circuit simulation; Coupling circuits; Frequency; Hafnium; Predictive models; Silicon; Stacking; Three-dimensional integrated circuits; Through-silicon vias;

fLanguage

English

Publisher

ieee

Conference_Titel

3D System Integration, 2009. 3DIC 2009. IEEE International Conference on

Conference_Location

San Francisco, CA

Print_ISBN

978-1-4244-4511-0

Electronic_ISBN

978-1-4244-4512-7

Type

conf

DOI

10.1109/3DIC.2009.5306547

Filename

5306547