• DocumentCode
    2214707
  • Title

    3-D memory organization and performance analysis for multi-processor network-on-chip architecture

  • Author

    Weldezion, Awet Yemane ; Lu, Zhonghai ; Weerasekera, Roshan ; Tenhunen, Hannu

  • Author_Institution
    Dept. of Electron., Comput., & Software Syst., KTH R. Inst. of Technol., Kista, Sweden
  • fYear
    2009
  • fDate
    28-30 Sept. 2009
  • Firstpage
    1
  • Lastpage
    7
  • Abstract
    Several forms of processor memory organizations have been in use to optimally access off-chip memory systems mainly the hard disk drives (HDD). Recent trends show that the solid state drives (SSD) such as flash memories replacing HDDs and multi-processor memory system realized in a single 3-D structure with network-on-chip (NOC) architecture as a communication medium. This paper discusses high level memory organization and architectural modeling and simulation based on 3D NOC. A comparative analysis among several models including Dance-hall, Sandwich, Terminal, Per-layer and mixed architectures is done. Simulations in cycle accurate 3-D NOC VHDL model are done to evaluate the performance each architecture in uniform and local traffic patterns.
  • Keywords
    microprocessor chips; network-on-chip; 3D memory organization; Dance-hall; Per-layer; Sandwich; Terminal; flash memories; hard disk drives; multiprocessor network-on-chip architecture; off-chip memory systems; processor memory organizations; solid state drives; Network-on-a-chip; Performance analysis;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    3D System Integration, 2009. 3DIC 2009. IEEE International Conference on
  • Conference_Location
    San Francisco, CA
  • Print_ISBN
    978-1-4244-4511-0
  • Electronic_ISBN
    978-1-4244-4512-7
  • Type

    conf

  • DOI
    10.1109/3DIC.2009.5306593
  • Filename
    5306593