• DocumentCode
    2215068
  • Title

    Analysis of thermal conductivity in Ni-doped CoSb3

  • Author

    Kitagawa, Hiroyuki ; Wakatsuki, Machiko ; Isoda, Yukihiro ; Shinohara, Yoshikazu ; Hasezaki, Kazuhiro ; Noda, Yasutoshi

  • Author_Institution
    Dept. of Mater. Sci., Shimane Univ., Matsue, Japan
  • fYear
    2005
  • fDate
    19-23 June 2005
  • Firstpage
    449
  • Lastpage
    452
  • Abstract
    Co1-xNixSb3 (x = 0.005≈0.1) samples were prepared by direct melting of constituent elements in a graphite crucible and subsequently was sintered using spark plasma sintering. The temperature dependence of the Hall coefficient, Hall mobility, Seebeck coefficient, electrical resistivity and thermal conductivity were investigated in a temperature range from 20 to 773 K. All the measured samples are n-type semiconductor and the conduction type changes from n- to p-type at around 450 K. The temperature for the transition from n-type to p-type increased with increasing Ni content x. The scattering factor, Fermi energy and Lorenz number were estimated and thermal conductivity was analyzed as a function of temperature. The lattice component of thermal conductivity is dominant at low temperatures but carrier and bipolar components become large at temperatures higher than the transition temperature.
  • Keywords
    Fermi level; Hall mobility; Seebeck effect; antimony alloys; cobalt alloys; electrical resistivity; melt processing; nickel; semiconductor materials; sintering; thermal conductivity; 20 to 773 K; Co1-xNixSb3; Fermi energy; Hall coefficient; Hall mobility; Lorenz number; Seebeck coefficient; direct melting; electrical resistivity; n-type semiconductor; p-type semiconductor; scattering factor; spark plasma sintering; thermal conductivity; Conductivity measurement; Electric resistance; Hall effect; Plasma measurements; Plasma temperature; Sparks; Temperature dependence; Temperature distribution; Thermal conductivity; Thermal resistance;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermoelectrics, 2005. ICT 2005. 24th International Conference on
  • ISSN
    1094-2734
  • Print_ISBN
    0-7803-9552-2
  • Type

    conf

  • DOI
    10.1109/ICT.2005.1519983
  • Filename
    1519983