DocumentCode
2215535
Title
Thermal Analysis of DLBI (Die Level Burn In) Carrier
Author
Park, Mike ; Khalil, Waleed
Author_Institution
Intel Corporation
fYear
1993
fDate
24-27 Oct 1993
Firstpage
203
Lastpage
204
Keywords
Biomembranes; Current density; Metallization; Microprocessors; Predictive models; Temperature dependence; Testing; Thermal conductivity; Thermal resistance; Very large scale integration;
fLanguage
English
Publisher
ieee
Conference_Titel
Integrated Reliability Workshop Final Report, 1993 International
Type
conf
DOI
10.1109/IRWS.1993.666313
Filename
666313
Link To Document