DocumentCode
2215702
Title
VLSI Metallization Screening Using Normalized Conductance Method
Author
Mohanti, Tapan ; Fu, Kuan-Yu
Author_Institution
Clemson University
fYear
1993
fDate
24-27 Oct 1993
Firstpage
204
Lastpage
205
Keywords
Current density; Fixtures; Metallization; Numerical simulation; Polyimides; Temperature dependence; Testing; Thermal resistance; Very large scale integration; Workstations;
fLanguage
English
Publisher
ieee
Conference_Titel
Integrated Reliability Workshop Final Report, 1993 International
Type
conf
DOI
10.1109/IRWS.1993.666314
Filename
666314
Link To Document