• DocumentCode
    2215725
  • Title

    A novel CPW low-pass filter using electromagnetic band-gap structure

  • Author

    Meng, Qingduan ; Zhang, Xiaoling ; Pu, Jiexin

  • Author_Institution
    Sch. of Electron. Inf. Eng., Henan Univ. of Sci. & Technol., Luoyang, China
  • fYear
    2009
  • fDate
    25-27 Sept. 2009
  • Firstpage
    267
  • Lastpage
    269
  • Abstract
    A novel low-pass filter with higher attenuation in rejection band is proposed in this paper, which is designed on a coplanar waveguide (CPW) structure with electromagnetic band gap (EBG) structure. In order to suppress passband ripples, the mono-periodic loaded interdigital capacitors structure is modified to double-periodic loaded structure. For higher attenuation in the rejection band without increasing circuit area, EBG structures with two dual-periodic arrays of rectangular patches are etched in the ground planes. Simulation results show that the average attenuation in the rejection band for a four-pole low-pass filter with EBG structure increases about 15dB, and the rejection bandwidth is broadened about 27%, that is, 20-dB bandwidth increases from 16.1GHz to 20.5GHz. Measurement verified the above results.
  • Keywords
    coplanar waveguides; low-pass filters; photonic band gap; waveguide filters; coplanar waveguide low-pass filter; double-periodic loaded structure; dual-periodic arrays; electromagnetic band gap structure; electromagnetic band-gap structure; interdigital capacitors structure; passband ripple suppression; rectangular patches; rejection band; Attenuation; Band pass filters; Bandwidth; Coplanar waveguides; Electromagnetic waveguides; Low pass filters; Metamaterials; Passband; Periodic structures; Waveguide discontinuities; coplanar waveguide; electromagnetic band-gap; low-pass filter;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Applied Superconductivity and Electromagnetic Devices, 2009. ASEMD 2009. International Conference on
  • Conference_Location
    Chengdu
  • Print_ISBN
    978-1-4244-3686-6
  • Electronic_ISBN
    978-1-4244-3687-3
  • Type

    conf

  • DOI
    10.1109/ASEMD.2009.5306639
  • Filename
    5306639