DocumentCode
2216208
Title
Sensitivity improvement of polypyrrole-based urea sensor using copper ion doping effect
Author
Yun, Dong-Hwa ; Song, Min-Jung ; Sim, Huijun ; Hong, Suk-In
Author_Institution
Dept. of Biol. & Chem. Eng., Korea Univ., Seoul
Volume
1
fYear
2006
fDate
22-25 Oct. 2006
Firstpage
574
Lastpage
575
Abstract
The functionalization of an integrated urea sensor by a copper-poly pyrrole matrix doping urease molecules and its application to the amperometric detection of urea is described. Copper cluster was doped into polypyrrole matrix to increase electrical conductivity. Urease was electroadsorbed onto this conductive matrix. The comparison of different organic and inorganic host matrices in terms of storage and operational stabilities clearly demonstrated the advantages of the composite matrix. Pt thin film electrode fabricated on silicon substrate by the radio frequency sputtering and titanium layer is also deposited as an underlayer to increase adhesive strength. The copper-doped polypyrrole and polypyrrole films are coated on platinum thin film electrode by cyclic voltammetry, respectively. Under the optimized condition, the limiting current obtained from the copper-doped polypyrrole urea sensor is proportional to the urea concentrations with the slope of 4.5 microampere per decade, which is two times higher sensitivity value than that of the polypyrrole urea sensor. In addition, the electrode surface was analyzed by scanning electro microscopy.
Keywords
amperometric sensors; biosensors; conducting polymers; copper; electrical conductivity; electrodes; patient monitoring; platinum; scanning electron microscopy; sputtering; thin films; voltammetry (chemical analysis); adhesive strength; amperometric detection; copper cluster; copper ion doping effect; cyclic voltammetry; electrical conductivity; platinum thin film electrode; polypyrrole matrix; polypyrrole-based urea sensor; radio frequency sputtering; scanning electro microscopy; silicon substrate; titanium layer; Active matrix organic light emitting diodes; Amperometric sensors; Conductive films; Conductivity; Copper; Doping; Electrodes; Sensor phenomena and characterization; Sputtering; Stability; amperometric detection; biosensor; copper doped polypyrrole; urea sensor;
fLanguage
English
Publisher
ieee
Conference_Titel
Nanotechnology Materials and Devices Conference, 2006. NMDC 2006. IEEE
Conference_Location
Gyeongju
Print_ISBN
978-1-4244-0540-4
Electronic_ISBN
978-1-4244-0541-1
Type
conf
DOI
10.1109/NMDC.2006.4388909
Filename
4388909
Link To Document