• DocumentCode
    2216208
  • Title

    Sensitivity improvement of polypyrrole-based urea sensor using copper ion doping effect

  • Author

    Yun, Dong-Hwa ; Song, Min-Jung ; Sim, Huijun ; Hong, Suk-In

  • Author_Institution
    Dept. of Biol. & Chem. Eng., Korea Univ., Seoul
  • Volume
    1
  • fYear
    2006
  • fDate
    22-25 Oct. 2006
  • Firstpage
    574
  • Lastpage
    575
  • Abstract
    The functionalization of an integrated urea sensor by a copper-poly pyrrole matrix doping urease molecules and its application to the amperometric detection of urea is described. Copper cluster was doped into polypyrrole matrix to increase electrical conductivity. Urease was electroadsorbed onto this conductive matrix. The comparison of different organic and inorganic host matrices in terms of storage and operational stabilities clearly demonstrated the advantages of the composite matrix. Pt thin film electrode fabricated on silicon substrate by the radio frequency sputtering and titanium layer is also deposited as an underlayer to increase adhesive strength. The copper-doped polypyrrole and polypyrrole films are coated on platinum thin film electrode by cyclic voltammetry, respectively. Under the optimized condition, the limiting current obtained from the copper-doped polypyrrole urea sensor is proportional to the urea concentrations with the slope of 4.5 microampere per decade, which is two times higher sensitivity value than that of the polypyrrole urea sensor. In addition, the electrode surface was analyzed by scanning electro microscopy.
  • Keywords
    amperometric sensors; biosensors; conducting polymers; copper; electrical conductivity; electrodes; patient monitoring; platinum; scanning electron microscopy; sputtering; thin films; voltammetry (chemical analysis); adhesive strength; amperometric detection; copper cluster; copper ion doping effect; cyclic voltammetry; electrical conductivity; platinum thin film electrode; polypyrrole matrix; polypyrrole-based urea sensor; radio frequency sputtering; scanning electro microscopy; silicon substrate; titanium layer; Active matrix organic light emitting diodes; Amperometric sensors; Conductive films; Conductivity; Copper; Doping; Electrodes; Sensor phenomena and characterization; Sputtering; Stability; amperometric detection; biosensor; copper doped polypyrrole; urea sensor;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Nanotechnology Materials and Devices Conference, 2006. NMDC 2006. IEEE
  • Conference_Location
    Gyeongju
  • Print_ISBN
    978-1-4244-0540-4
  • Electronic_ISBN
    978-1-4244-0541-1
  • Type

    conf

  • DOI
    10.1109/NMDC.2006.4388909
  • Filename
    4388909