DocumentCode
2217949
Title
Proceedings 1996 IEEE Multi-Chip Module Conference (Cat. No.96CH35893)
fYear
1996
fDate
6-7 Feb. 1996
Abstract
The following topics were dealt with: infrastructure issues; new MCM applications; flip-chip MCMs; mixed-signal MCMs; electrical design; design optimization; computer-aided design; advances in MCM technology; interconnect modeling
Keywords
circuit CAD; circuit optimisation; flip-chip devices; integrated circuit design; integrated circuit packaging; mixed analogue-digital integrated circuits; multichip modules; MCM applications; MCM technology; computer-aided design; design optimization; electrical design; flip-chip MCMs; interconnect modeling; mixed-signal MCMs; multi-chip module;
fLanguage
English
Publisher
ieee
Conference_Titel
Multi-Chip Module Conference, 1996. MCMC-96, Proceedings., 1996 IEEE
Conference_Location
Santa Cruz, CA, USA
Print_ISBN
0-8186-7286-2
Type
conf
DOI
10.1109/MCMC.1996.510759
Filename
510759
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