A multichip module solution for high performance ATM switching

Author

Licciardi, L. ; Peretti, M. ; Pilati, L. ; Ichai, J.J. ; Martin, F. ; Urena, P.Y.

Author_Institution

CSELT, Torino, Italy

fYear

1996

fDate

6-7 Feb 1996

Firstpage

10

Lastpage

15

Abstract

the high industrial importance that ATM (asynchronous transfer mode) is assuming in the telecommunication environment strongly drives technology improvements. A MCM-C 16×16 Switching Element (MCM-BASE16) for the industrial ATM cross connect UTXC is presented; implementation details are described regarding both the substate characteristics and the new IBM CCGA (ceramic column grid array) packaging technique. Electrical and thermal analysis results are reported and finally the testing methodology is presented both at the substrate and at the module level. The MCM-BASEI6 has a global throughput of 5 Gbit/s, works at 77.8 MHz and dissipates approximately 10 W at the operating frequency; these results confirm the effectiveness of this new packaging technique in obtaining high speed and area performance

Keywords

asynchronous transfer mode; multichip modules; simulation; telecommunication equipment testing; 10 W; 5 Gbit/s; 77.8 MHz; IBM CCGA; MCM-BASE16; MCM-C; area performance; ceramic column grid array; electrical analysis; high performance ATM switching; high speed performance; industrial ATM cross connect UTXC; multichip module; substate characteristics; telecommunication environment; thermal analysis; Asynchronous transfer mode; Circuit testing; Clocks; Communication industry; Frequency; Integrated circuit packaging; Microprocessors; Multichip modules; Switches; Telecommunication switching;

fLanguage

English

Publisher

ieee

Conference_Titel

Multi-Chip Module Conference, 1996. MCMC-96, Proceedings., 1996 IEEE

Conference_Location

Santa Cruz, CA

Print_ISBN

0-8186-7286-2

Type

conf

DOI

10.1109/MCMC.1996.510761

Filename

510761