• DocumentCode
    2218411
  • Title

    A sensitivity-based wiresizing approach to interconnect optimization of lossy transmission line topologies

  • Author

    Xue, Tianxiong ; Kuh, Ernest S. ; Yu, Qingjian

  • Author_Institution
    Dept. of Electr. Eng., California Univ., Berkeley, CA, USA
  • fYear
    1996
  • fDate
    6-7 Feb 1996
  • Firstpage
    117
  • Lastpage
    122
  • Abstract
    This paper presents a sensitivity-based wiresizing algorithm for interconnect delay optimization of lossy transmission line topology under MCM technologies. Our approach computes the maximum delay and its sensitivities with respect to the widths of wires in the topology via high order moments based on an exact moment matching model. Compared with other approaches, it achieves analytical sensitivity computation and calculates higher order moments (sensitivities) recursively from lower order moments for tree network. It can yield optimal wiresizing solution for interconnect delay minimization. Experiments show that the delay estimation using high order moments is very accurate compared with SPICE simulation and our approach can reduce the maximum rising delay by over 60% with small penalty in routing area. Besides delay optimization, the final solution eliminates the over-shoot of response waveform and is robust under parameter variations
  • Keywords
    delays; integrated circuit interconnections; method of moments; multichip modules; network routing; sensitivity analysis; trees (mathematics); wiring; MCM technologies; delay optimization; high order moments; interconnect optimization; lossy transmission line topologies; maximum rising delay; moment matching model; parameter variations; routing area; sensitivity-based wiresizing approach; tree network; Computational modeling; Computer networks; Delay estimation; Network topology; Propagation delay; Propagation losses; Routing; SPICE; Transmission lines; Wires;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Multi-Chip Module Conference, 1996. MCMC-96, Proceedings., 1996 IEEE
  • Conference_Location
    Santa Cruz, CA
  • Print_ISBN
    0-8186-7286-2
  • Type

    conf

  • DOI
    10.1109/MCMC.1996.510780
  • Filename
    510780