DocumentCode
2219200
Title
Packaging and interconnect solutions for a low cost surface-mountable millimeter-wave radar sensor
Author
Beer, Stefan ; Gulan, Heiko ; Ripka, Benedikt ; Pahl, Philipp ; Zwick, Thomas
Author_Institution
Inst. fuer Hochfrequenztech. und Elektron. (IHE), Karlsruhe Inst. of Technol. (KIT), Karlsruhe, Germany
fYear
2011
fDate
27-28 Sept. 2011
Firstpage
1
Lastpage
4
Abstract
This paper introduces the idea of a low-cost surface-mountable millimeter-wave radar sensor. Different packaging topologies are compared with the aim of realizing a complete system-in-package. Finally, two different possibilities of interconnecting a Silicon MMIC with an off-chip antenna are evaluated based on simulations and measurements within the frequency range from 110 GHz to 170 GHz.
Keywords
MMIC; electronics packaging; millimetre wave radar; radar antennas; MMIC; frequency 110 GHz to 170 GHz; interconnect solutions; low cost surface-mountable millimeter-wave radar sensor; off-chip antenna; packaging topologies; system-in-package; Antennas; Flip chip; Integrated circuit interconnections; MMICs; Packaging; Transmission line measurements; Wires; Bond Wire; Flip Chip; Interconnects; System-in-Package; System-on-Chip;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Conference Dresden (SCD), 2011
Conference_Location
Dresden
Print_ISBN
978-1-4577-0431-4
Type
conf
DOI
10.1109/SCD.2011.6068749
Filename
6068749
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