• DocumentCode
    2219452
  • Title

    Chemical stability of the titania layer formed synthetically on NiTi shape memory alloy as a barrier to prevent nickel ion release

  • Author

    Sun, Tao ; Wang, Min

  • Author_Institution
    Dept. of Mech. Eng., Univ. of Hong Kong, Hong Kong
  • fYear
    2008
  • fDate
    30-31 May 2008
  • Firstpage
    541
  • Lastpage
    544
  • Abstract
    To improve the biocompatibility of NiTi shape memory alloy (SMA), a titanium oxide layer was fabricated on the surface of NiTi SMA using an established H2O2-oxidation and hot water aging technique. The chemical stability of the titania surface layer in simulated body fluids was investigated via potentiostatiodynamic polarization tests. After the chemical stability tests, the surface morphology of samples was examined using a scanning electron microscope (SEM). Compared to the untreated NiTi SMA samples, higher corrosion potential (Ecorr) and breakdown potential (Eb) and lower breakdown current were observed for NiTi SMA samples with the synthetic titanium oxide surface layer. The results suggest that NiTi SMA samples covered by the titania layer had better chemical stability. This oxide layer could act as a physical barrier to prevent Ni ion release from NiTi SMA implants.
  • Keywords
    biomedical materials; corrosion; nickel alloys; prosthetics; scanning electron microscopy; shape memory effects; surface morphology; titanium alloys; titanium compounds; H2O2-oxidation; NiTi; TiO; biocompatibility; breakdown current; breakdown potential; chemical stability; corrosion potential; hot water aging technique; potentiostatiodynamic polarization; scanning electron microscope; shape memory alloy implants; surface morphology; titania layer; titanium oxide layer; Aging; Chemicals; Electric breakdown; Nickel; Scanning electron microscopy; Shape memory alloys; Stability; Surface morphology; Testing; Titanium;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Information Technology and Applications in Biomedicine, 2008. ITAB 2008. International Conference on
  • Conference_Location
    Shenzhen
  • Print_ISBN
    978-1-4244-2254-8
  • Electronic_ISBN
    978-1-4244-2255-5
  • Type

    conf

  • DOI
    10.1109/ITAB.2008.4570641
  • Filename
    4570641