Micromechanical model of a thin film intrafascicular electrode during insertion into peripheral nerves

Author

Bossi, Silvia ; Sergi, Pier Nicola ; Micera, Silvestro

Author_Institution

ARTS Lab., Scuola Superiore Sant´´Anna di Studi Universitari e di Perfezionamento (SSSA), Pisa, Italy

fYear

2009

fDate

April 29 2009-May 2 2009

Firstpage

100

Lastpage

103

Abstract

In this paper a thin film intrafascicular interface has been modeled during the insertion procedure inside peripheral nerves using a theoretical approach and a FEM analysis. In particular, the aim was to investigate the effects of several characteristics of the intraneural interfaces (e.g., the interface width and Kevlar filament diameter) on the maximal Von Mises stress reached during implantation. The results were used to gather new guidelines to develop more reliable thin film interfaces with maximal success rate during the implantation phase.

Keywords

bioMEMS; bioelectric phenomena; biomedical electrodes; finite element analysis; microelectrodes; neurophysiology; reliability; thin film devices; FEM analysis; Kevlar filament diameter; implantation phase; interface width; intraneural interface; maximal Von Mises stress; micromechanical model; peripheral nerves; reliable thin film intrafascicular electrode insertion; theoretical approach; Electrodes; Geometry; Guidelines; Micromechanical devices; Needles; Polyimides; Stress; Transistors; Tungsten; Wire; FEM analysis; Neural interface; insertion procedure; micromechanical sudy; peripheral nerve;

fLanguage

English

Publisher

ieee

Conference_Titel

Neural Engineering, 2009. NER '09. 4th International IEEE/EMBS Conference on

Conference_Location

Antalya

Print_ISBN

978-1-4244-2072-8

Electronic_ISBN

978-1-4244-2073-5

Type

conf

DOI

10.1109/NER.2009.5109244

Filename

5109244