• DocumentCode
    2226075
  • Title

    VACNT-on-silicon platform for improving heat conduction in optoelectronic packaging

  • Author

    Chen, Szu-Chieh ; Lo, Hsinyi ; Hung, Yung-Jr ; Pan, Yen-Ting ; Lee, San-Liang ; Ram, Rajeev J.

  • Author_Institution
    Dept. of Electron. Eng., Nat. Taiwan Univ. of Sci. & Technol., Taipei, Taiwan
  • fYear
    2011
  • fDate
    1-6 May 2011
  • Firstpage
    1
  • Lastpage
    2
  • Abstract
    Silicon platforms with high-density vertically aligned carbon nanotubes on patterned substrates are designed to provide efficient thermal transfer for optoelectronic chips. 20% increase in output power is obtained when applying for LED packaging.
  • Keywords
    carbon nanotubes; electronics packaging; heat conduction; light emitting diodes; LED packaging; VACNT-on-silicon platform; heat conduction; high-density vertically aligned carbon nanotubes; optoelectronic packaging; patterned substrates; Electronic packaging thermal management; Heating; Light emitting diodes; Silicon; Thermal conductivity; Thermal resistance;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Lasers and Electro-Optics (CLEO), 2011 Conference on
  • Conference_Location
    Baltimore, MD
  • Print_ISBN
    978-1-4577-1223-4
  • Type

    conf

  • Filename
    5950067
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2226075