DocumentCode
2226934
Title
A multi-plant tolerance allocation model for assembled electronic products
Author
Huang, Feng-Yi ; Tseng, Yuan-Jye
Author_Institution
Dept. of Ind. Eng. & Manage., Yuan Ze Univ., Taoyuan, Taiwan
fYear
2008
fDate
8-11 Dec. 2008
Firstpage
1194
Lastpage
1198
Abstract
To produce an assembled electronic product, the components are manufactured with certain manufacturing operations and then assembled with the required assembly operations. In the manufacturing operations, each component must be manufactured within the allocated working tolerances such that the assembly operations can be performed to build the final product. In a collaborative manufacturing system, the components are assigned to the available manufacturing operations with different tolerance and cost characteristics at different plants. In this research, a multi-plant tolerance allocation model for assembled electronic products is presented. Firstly, given the blueprint dimensions and tolerances of a product, a tolerance allocation model is presented to determine the working tolerance of each of the components to maximize the cumulative sum of the working tolerances. Finally, a mathematical programming model is presented to assign the components to the suitable plants with minimized multi-plant manufacturing costs. An example product is tested and illustrated.
Keywords
assembling; electronic products; manufacturing systems; mathematical programming; tolerance analysis; assembled electronic products; collaborative manufacturing system; final product; manufacturing operations; mathematical programming model; multiplant tolerance allocation model; working tolerances; Assembly; Collaborative work; Costs; Electronic components; Flexible printed circuits; Industrial electronics; Manufacturing processes; Plastics; Semiconductor materials; Virtual manufacturing; Assembled electronic products; collaborative manufacturing; multi-plants; tolerance allocation;
fLanguage
English
Publisher
ieee
Conference_Titel
Industrial Engineering and Engineering Management, 2008. IEEM 2008. IEEE International Conference on
Conference_Location
Singapore
Print_ISBN
978-1-4244-2629-4
Electronic_ISBN
978-1-4244-2630-0
Type
conf
DOI
10.1109/IEEM.2008.4738059
Filename
4738059
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