• DocumentCode
    2226934
  • Title

    A multi-plant tolerance allocation model for assembled electronic products

  • Author

    Huang, Feng-Yi ; Tseng, Yuan-Jye

  • Author_Institution
    Dept. of Ind. Eng. & Manage., Yuan Ze Univ., Taoyuan, Taiwan
  • fYear
    2008
  • fDate
    8-11 Dec. 2008
  • Firstpage
    1194
  • Lastpage
    1198
  • Abstract
    To produce an assembled electronic product, the components are manufactured with certain manufacturing operations and then assembled with the required assembly operations. In the manufacturing operations, each component must be manufactured within the allocated working tolerances such that the assembly operations can be performed to build the final product. In a collaborative manufacturing system, the components are assigned to the available manufacturing operations with different tolerance and cost characteristics at different plants. In this research, a multi-plant tolerance allocation model for assembled electronic products is presented. Firstly, given the blueprint dimensions and tolerances of a product, a tolerance allocation model is presented to determine the working tolerance of each of the components to maximize the cumulative sum of the working tolerances. Finally, a mathematical programming model is presented to assign the components to the suitable plants with minimized multi-plant manufacturing costs. An example product is tested and illustrated.
  • Keywords
    assembling; electronic products; manufacturing systems; mathematical programming; tolerance analysis; assembled electronic products; collaborative manufacturing system; final product; manufacturing operations; mathematical programming model; multiplant tolerance allocation model; working tolerances; Assembly; Collaborative work; Costs; Electronic components; Flexible printed circuits; Industrial electronics; Manufacturing processes; Plastics; Semiconductor materials; Virtual manufacturing; Assembled electronic products; collaborative manufacturing; multi-plants; tolerance allocation;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Industrial Engineering and Engineering Management, 2008. IEEM 2008. IEEE International Conference on
  • Conference_Location
    Singapore
  • Print_ISBN
    978-1-4244-2629-4
  • Electronic_ISBN
    978-1-4244-2630-0
  • Type

    conf

  • DOI
    10.1109/IEEM.2008.4738059
  • Filename
    4738059