• DocumentCode
    2237813
  • Title

    On the rseries extraction techniques for sub-22nm CMOS finfet and SiGe technologies

  • Author

    Pantisano, Luigi ; Zschaetzsch, G. ; Hellings, G. ; Krom, R. ; Lee, S.-H. ; Ritzenthaler, R. ; Mitard, J. ; Eneman, G. ; Roussel, Ph J. ; Chiarella, T. ; Ragnarsson, L-Å ; Togo, M. ; Vandervorst, W. ; Groeseneken, G. ; Thean, A. ; Horiguchi, N.

  • Author_Institution
    IMEC Leuven (Belgium), Leuven, Belgium
  • fYear
    2012
  • fDate
    23-25 April 2012
  • Firstpage
    1
  • Lastpage
    2
  • Abstract
    Introduction: Series resistance (Rseries) is a crucial factor for technology optimization and benchmarking [1-3]. Rseries is typically extracted in the bias conditions where Rseries dominates, i.e., linear regime and high Vgs by comparing multiple gate lengths. However this simple extraction is very challenging for sub22nm CMOS devices as changing a device length / width may change mobility or Rseries. For instance, this is the case for SiGe where the built-in stress effect [5,6] increases the channel mobility thus making the standard extraction difficult. The case is even more compelling for the bulk finfet case where the length width and height may not be known with the necessary precision and the gate stack itself may introduce (un)wanted stress components. As any Rseries extraction do rely critically on assumptions, in this paper we will first test the applicability and limits of several Rseries extraction techniques [1-3] and then use the best of both to gain new insights on the finfet and SiGe technology.
  • Keywords
    CMOS integrated circuits; Ge-Si alloys; MOSFET; CMOS finfet; Si-Ge; benchmarking; built-in stress effect; bulk finfet case; change mobility; extraction technique; gate stack; multiple gate length; series resistance; technology optimization; Logic gates; Resistance; Resistors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    VLSI Technology, Systems, and Applications (VLSI-TSA), 2012 International Symposium on
  • Conference_Location
    Hsinchu
  • ISSN
    1930-8868
  • Print_ISBN
    978-1-4577-2083-3
  • Type

    conf

  • DOI
    10.1109/VLSI-TSA.2012.6210128
  • Filename
    6210128