DocumentCode
2239659
Title
5-Gb/s Chip-to-chip Optical Interconnection Using Polymeric Waveguides
Author
Kim, Do-Won ; Cho, In-Kui ; Ahn, Seung Ho ; Park, Hyo-Hoon
Author_Institution
Inf. & Commun. Univ., Daejeon
fYear
2007
fDate
26-31 Aug. 2007
Firstpage
1
Lastpage
2
Abstract
A chip-to-chip optical interconnection system using polymeric waveguide was fabricated. Hot-embossing technique was used to fabricate polymeric waveguide. Thermally stable polycarbonate as a clad material and UV-curable epoxy resin as a core material were used for optical waveguides. Eye diagram was successfully measured at the speed of 5 Gb/s/ch.
Keywords
embossing; optical interconnections; optical waveguides; polymers; UV-curable epoxy resin; bit rate 5 Gbit/s; chip-to-chip optical interconnection; clad material; core material; hot embossing; optical waveguides; polymeric waveguides; thermally stable polycarbonate; Optical arrays; Optical films; Optical interconnections; Optical materials; Optical polymers; Optical refraction; Optical transmitters; Optical variables control; Optical waveguides; Refractive index;
fLanguage
English
Publisher
ieee
Conference_Titel
Lasers and Electro-Optics - Pacific Rim, 2007. CLEO/Pacific Rim 2007. Conference on
Conference_Location
Seoul
Print_ISBN
978-1-4244-1173-3
Electronic_ISBN
978-1-4244-1174-0
Type
conf
DOI
10.1109/CLEOPR.2007.4391206
Filename
4391206
Link To Document