• DocumentCode
    2239763
  • Title

    Fast parameters extraction of general three-dimension interconnects using geometry independent measured equation of invariance

  • Author

    Sun, Weikai ; Wei-Ming, W. ; Hong, Wei

  • Author_Institution
    California Univ., Santa Cruz, CA, USA
  • fYear
    1996
  • fDate
    3-7 Jun, 1996
  • Firstpage
    371
  • Lastpage
    376
  • Abstract
    Measured Equation of Invariance (MEI) is a new concept in computational electromagnetics. It has been demonstrated that the MEI technique can be used to terminate the meshes very close to the object boundary and still strictly preserves the sparsity of the FD equations. Therefore, the final system matrix encountered by MEI is a sparse matrix with size similar to that of integral equation methods. However, complicated Green´s function and disagreeable Sommerfeld integrals make the traditional MEI very difficult, if not impossible, to be applied to analyze multilayer and multiconductor interconnects. In this paper, we propose the Geometry Independent MEI (GIMEI) which substantially improved the original MEI method. We use GIMEI for capacitance extraction of general three-dimension VLSI interconnect. Numerical results are in good agreement with published data and those obtained by using FASTCAP, while GIMEI is generally an order of magnitude faster than FASTCAP and uses significant less memory than FASTCAP
  • Keywords
    circuit CAD; circuit analysis computing; integrated circuit interconnections; GIMEI; computational electromagnetics; geometry independent measured equation of invariance; multiconductor; multilayer; sparse matrix; three-dimension VLSI interconnect; three-dimension interconnects; Capacitance; Computational electromagnetics; Data mining; Electromagnetic measurements; Geometry; Green´s function methods; Integral equations; Nonhomogeneous media; Parameter extraction; Sparse matrices;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Design Automation Conference Proceedings 1996, 33rd
  • Conference_Location
    Las Vegas, NV
  • ISSN
    0738-100X
  • Print_ISBN
    0-7803-3294-6
  • Type

    conf

  • DOI
    10.1109/DAC.1996.545604
  • Filename
    545604