Localized substrate removal technique enabling strong-confinement microphotonics in bulk Si CMOS processes

Author

Holzwarth, Charles W. ; Orcutt, Jason S. ; Li, Hanqing ; Popovic, Milos A. ; Stojanovic, Vladimir ; HOyt, Judy L. ; Ram, Rajeev J. ; Smith, Henry I.

Author_Institution

Res. Lab. of Electron., Massachusetts Inst. of Technol., Cambridge, MA

fYear

2008

fDate

4-9 May 2008

Firstpage

1

Lastpage

2

Abstract

A novel post-processing fabrication technique, based on XeF₂ etching, has been developed to locally remove the silicon substrate beneath polysilicon waveguides, enabling integration of low-loss strong-confinement microphotonics into standard bulk-silicon CMOS process flows.

Keywords

CMOS integrated circuits; elemental semiconductors; etching; integrated optics; optical fabrication; optical losses; optical waveguides; silicon; xenon compounds; Si; XeF₂; bulk silicon CMOS processes; etching process; localized substrate removal technique; low-loss strong-confinement microphotonics; polysilicon waveguides; post-processing fabrication technique; silicon substrate; CMOS process; CMOS technology; Etching; Fabrication; Lithography; Optical waveguides; Photonic integrated circuits; Propagation losses; Silicon; Substrates; (220.4000) Microstructure fabrication; (230.7370) Waveguides; (250.5300) Photonic integrated circuits;

fLanguage

English

Publisher

iet

Conference_Titel

Lasers and Electro-Optics, 2008 and 2008 Conference on Quantum Electronics and Laser Science. CLEO/QELS 2008. Conference on

Conference_Location

San Jose, CA

Print_ISBN

978-1-55752-859-9

Type

conf

Filename

4571716