• DocumentCode
    2247037
  • Title

    Singular stress analysis in a viscoelastic thin layer bonded to an elastic substrate using realistic relaxation function

  • Author

    Lee, Sang Soon

  • Author_Institution
    Sch. of Mechatronics Eng., Korea Univ. of Technol. & Educ., Chungnam, South Korea
  • fYear
    2001
  • fDate
    2001
  • Firstpage
    353
  • Lastpage
    356
  • Abstract
    This paper deals with the stress singularity induced at the interface corner between the perfectly bonded thin layer and elastic substrate subjected to a uniform temperature change and a shear loading using realistic relaxation function. The thin layer is assumed to be a linear viscoelastic material. The time-domain boundary element method is used to investigate the behavior of stresses for the whole interface. Within the context of a linear viscoelastic theory, a stress singularity exists at the point where the interface between one of the elastic substrate and the viscoelastic thin layer intersects the free surface
  • Keywords
    boundary-elements methods; interface structure; packaging; stress analysis; stress relaxation; thermal stresses; time-domain analysis; viscoelasticity; elastic substrate; free surface; interface corner; linear viscoelastic theory; perfectly bonded thin layer; relaxation function; shear loading; singular stress analysis; stress behavior; stress singularity; thin layer linear viscoelastic material; time-domain boundary element method; uniform temperature change; viscoelastic thin layer; Bonding; Dielectric substrates; Educational technology; Elasticity; Electronic packaging thermal management; Laplace equations; Residual stresses; Temperature; Thermal stresses; Viscosity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Materials and Packaging, 2001. EMAP 2001. Advances in
  • Conference_Location
    Jeju Island
  • Print_ISBN
    0-7803-7157-7
  • Type

    conf

  • DOI
    10.1109/EMAP.2001.984009
  • Filename
    984009