DocumentCode
2247037
Title
Singular stress analysis in a viscoelastic thin layer bonded to an elastic substrate using realistic relaxation function
Author
Lee, Sang Soon
Author_Institution
Sch. of Mechatronics Eng., Korea Univ. of Technol. & Educ., Chungnam, South Korea
fYear
2001
fDate
2001
Firstpage
353
Lastpage
356
Abstract
This paper deals with the stress singularity induced at the interface corner between the perfectly bonded thin layer and elastic substrate subjected to a uniform temperature change and a shear loading using realistic relaxation function. The thin layer is assumed to be a linear viscoelastic material. The time-domain boundary element method is used to investigate the behavior of stresses for the whole interface. Within the context of a linear viscoelastic theory, a stress singularity exists at the point where the interface between one of the elastic substrate and the viscoelastic thin layer intersects the free surface
Keywords
boundary-elements methods; interface structure; packaging; stress analysis; stress relaxation; thermal stresses; time-domain analysis; viscoelasticity; elastic substrate; free surface; interface corner; linear viscoelastic theory; perfectly bonded thin layer; relaxation function; shear loading; singular stress analysis; stress behavior; stress singularity; thin layer linear viscoelastic material; time-domain boundary element method; uniform temperature change; viscoelastic thin layer; Bonding; Dielectric substrates; Educational technology; Elasticity; Electronic packaging thermal management; Laplace equations; Residual stresses; Temperature; Thermal stresses; Viscosity;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Materials and Packaging, 2001. EMAP 2001. Advances in
Conference_Location
Jeju Island
Print_ISBN
0-7803-7157-7
Type
conf
DOI
10.1109/EMAP.2001.984009
Filename
984009
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